Black yellow highlight.
Antec lanboy air open frame case.
The antec lanboy air modular open frame case is an innovative case with open air mesh construction and modular components that allow for a wide variety of configurations and individual customization.
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Squad antec memory atom.
Meet the lanboy air.
Meet the lanboy air.
Yellow antec lanboy air mid tower modular open frame gaming computer case rating required select rating 1 star worst 2 stars 3 stars average 4 stars 5 stars best name.
Antec lanboy air yellow.
All meshed panel upto 15 exhaust fans.
Along with its two internal 2 5 ssd bays and a front panel usb 3 0 port the lanboy air is the last word in high flexibility pc case design.
Case performance series gaming series cube value solution nx series isk series new solution other power supply by series 80 plus cooling case fan cpu liquid cooler cpu air cooler.
Fully modular and customizable.
Up to 15 exhaust fans create positive air pressure inside the case that blows dust and heat out through panel perforations.
Awards case power supply cooling.
The antec lanboy air is an open frame mesh construction mid tower computer case that is quite portable and looks damn good just like the legend that the name of the antec lanboy implies.
Airmounts hdd mounting system.
Nearly every part on this case even the motherboard and psu mounts is modular and customizable.
Torque a commanding mid tower with a forward tilted motherboard position aggressive lines and plenty of features designed for performance heavy builds merges precision cut aluminum panels in high contrast crimson and gunmetal to bring an augmented experience to your desktop.
Nearly every part on this case even the motherboard and psu mounts is modular and customizable.
Nearly every part on this case even the motherboard and psu mounts is modular and customizable.
Up to 15 exhaust fans create positive air pressure inside the case that blows dust and heat out through panel perforations.
Up to 15 exhaust fans create positive air pressure inside the case that blows dust and heat out through panel perforations.
